HS-EB6000 is a fully automated eutectic solid state bonder with gold-tin eutectic bonder function.
It is developed for precise soldering process.
It is equipped with an independently controlled rotary pick-up axis system and a nozzle heating function, and has a preheating zone, a holding zone and a cooling zone to prevent thermal shock and to ensure an oxygen-free solidification environment.
It is highly flexible and suitable for R&D units and industrialized mass production.
Preheat
Thermos (bottle)
Thermostatic
Laminating Accuracy
Laminating Pressure
Constant temperature heating
Nitrogen Protection
Use of nitrogen to fill the mounting area to reduce air influence
Safe production
Multiple recovery of reducing, flammable and explosive gases from protective gases
