High-precision coupling and packaging machine High-precision coupling and packaging machine

High-speed solid crystal machine equipment

LQ-DA1201‌

LQ-DA1201 high-speed solid crystal machine is a high-speed and high-precision encapsulation equipment for IC solid crystal industry, which combines innovative high-tech and mature technology.

The equipment supports silver paste placement and DAF process, and is compatible with LF and Substrate feed, DIE feed supports 12" wafer frame & wafer ring.

The highest placement accuracy of the equipment meets ±12.5um, UPH up to 12K.

  • Compatibility

  • Silver Paste Patch

  • High Speed

LQ-DA1201‌

Application Area

  • Photonics

  • Power Devices

  • Microwave RF Device Field

  • New Energy Vehicle Sector

Technical Parameter

  • High-precision mounting with feature side up

    Mounting Method

  • Silver Glue Mounting Process, DAF Process

    Mounting Process

  • IC device SMD package

    Product Applications

  • Servo recoil technology

    ±12.5μm (precision mode); ±25μm (standard mode)

  • Large-size multiplexed vision system

    ±1°

  • Human-computer Interface
  • Dispense Gel
     Automatic position calibration, glue recognition position
  • Feedstock
    6"8"12"WAFER RING&GEL-PAK
  • Mounting Accuracy
    Precision mode: 5um @3σ placement accuracy  
    ±0.5°@3σ Mounting Rotation Accuracy
    Standard Mode: 15um @3σ Placement Accuracy
    ±1°@3σ Mounting Rotation Accuracy
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