High-precision coupling and packaging machine High-precision coupling and packaging machine

Multi-Chip Mounting Equipment

HS-DB3000‌

HS-DB3000 is a multi-functional high-speed mounting equipment for high-volume industrialized production.

It is equipped with a freely adjustable width conveyor system for seamless connection with other equipments; it is equipped with a 12-inch wafer loading system, an automatic wafer changer and an automatic nozzle changer to satisfy customers' multi-chip mounting needs.

Modular design provides flexible customization capability. Intelligent calibration and data management system enables the equipment to have the ability of process traceability and management, and at the same time, the operation is more convenient.

  • Highly Accurate

  • Freewheeling

  • Customizable

HS-DB3000‌

Application Area

  • Photonics

  • Power Devices

  • Microwave RF Device Field

  • New Energy Vehicle Sector

Technical Parameter

  • Epoxy adhesive mounting process (dipping, scribing) Positive mounting, back mounting

    Mounting Process

  • ±3um (standard sheet); ±7um, θ ±0.1° (application dependent)

    Mounting Accuracy

  • 3s-7s (depending on the specific application)

    Equipment Efficiency

  • Gel Control Method

    Pressure time control (can be customized if special requirements)

  • Altimetry

    Contact sensor height measurement (optional non-contact)

  • 0~200mm adjustable, support string production
  • Multi-form feeding: Compatible with multi-size blue film feeding,
    program control and flexible switching.
  • High-performance placement: supports up to 12 nozzles for
    fast switching and high-performance placement.
  • Multi-tasking integration: 5 types of glue dipping needles can
                 be configured to meet diversified process requirements.
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