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High-precision coupling and packaging machine High-precision coupling and packaging machine

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High Precision Eutectic Mounter

HP-EB3300

  • Automation

  • Accurate

  • Highly Flexible

HP-EB3300

Application Area

  • Photonics

  • Power Devices

  • Microwave RF Device Field

  • New Energy Vehicle Sector

Technical Parameter

  • Front/Back Reference Mount

    Mounting Method

  • Eutectic Mounting (dipping, dispensing)

    Mounting Process

  • COC；COS

    Application Scenarios

  • Mounting Accuracy

    ±1 μm (standard tablets); ±3 μm (application dependent)

  • Equipment Efficiency

    [20~25]S/PCS (application-dependent)

  • Dual Heating Welding Station

    Temperature control range: room temperature ~ 400 ℃
    temperature increase rate: ≤ 100 ℃ / S

  • Dispensing & Dipping

    Glue-dipped, self-calibrating tip

  • Feedstock

    2“GEL-PAK 2“WAFFLE-PAK
    6” WAFER RING 8” WAFER RING

  • Bonding accuracy

    ±3μm @ 3σ placement accuracy
    ±0.1° @ 3σ placement rotation accuracy

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