High-precision coupling and packaging machine High-precision coupling and packaging machine

Chip aging sealing and testing equipment

COC BI Tester LQ-BI114

LQ-BI114 is an equipment specially developed for aging test of COC devices.

The main body of the equipment adopts a frame structure, and the carrier adopts a separable “drawer” form, and each drawer can control the temperature independently.

The carrier adopts standard quick-plug electrical interface, which can be designed according to different products and different carriers can be tested in the same test platform.

  • Split-type

  • Independent Temperature Control

  • High-precision Temperature Control

COC BI Tester LQ-BI114

Application Area

  • Photonics

  • Power Devices

  • Microwave RF Device Field

  • New Energy Vehicle Sector

Technical Parameter

  • EML COC&DFB COC

    LD Chip Type

  • ACC  LIV

    Test Functions

  • Can be set according to specific process

    Aging Test Time

  • Submount Size

    Customized according to customer needs

  • Wavelength range

    1000nm—1600nm

  • Temperature control panel

    Self-developed temperature control design
    high precision temperature control
  • High Precision Vision System

    Support re-inspection function to ensure
    the stability of product quality
  • Feedstock

    2“GEL-PAK 、6” WAFER RING
  • Rotary table

    Separate workstations and synchronized
    operation to enhance efficiency
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