The way in which the high-precision coupling sealing machine ensures the precision of chip encapsulation is mainly reflected in the following aspects:

Advanced Mechanical Structure Design

High-precision Transmission System: the adoption of high-precision ballscrews and linear guides can accurately convert the rotary motion of the motor into linear motion, and the positioning precision can reach the level of micrometers. For example, in the process of chip handling and alignment, it can ensure that the displacement error of the chip in the horizontal and vertical directions is extremely small.

Stable mechanical frame: The body of the packaging machine is usually made of high-strength aluminum alloy or cast iron, which is precision machined and heat-treated to provide good rigidity and stability, and can effectively reduce the errors caused by mechanical vibration or deformation in the packaging process.

High-precision Sensors and Detection Technology

Visual Recognition System: Equipped with high-resolution industrial cameras and advanced image processing algorithms, it is capable of real-time monitoring and recognition of chips and encapsulation molds. By analyzing the edges, markings and other features of the chip, the position and attitude of the chip are precisely calculated, and the error can be controlled at the sub-micron level.

Laser Ranging Sensor: Utilizing the reflection principle of laser, it accurately measures the distance between the chip and the encapsulation head to ensure that the encapsulation head can accurately contact the chip surface during the descending process and realize precise encapsulation operation.

Precise control system

Motion control algorithm: adopting advanced motion control algorithm, such as PID control algorithm, fuzzy control algorithm, etc., it can adjust the motion speed and position of each axis of the encapsulation machine in real time according to the information fed back from the sensors, so as to realize the precise control of the encapsulation process.

Temperature control system: In the encapsulation process, the temperature has an important impact on the performance of the chip and encapsulation materials. High-precision coupling packaging machine is usually equipped with high-precision temperature sensors and temperature control modules, which can control the temperature of the encapsulation area in a very precise range to ensure the fluidity of the encapsulation material and curing effect, thus improving the accuracy of the encapsulation.

High-precision encapsulation process and materials

Encapsulation process optimization: Ensure the stability and consistency of the encapsulation process by continuously optimizing the encapsulation process parameters, such as encapsulation pressure, encapsulation time and curing temperature.

High-quality encapsulation materials: Selection of encapsulation materials with low coefficient of thermal expansion, good fluidity and high bonding strength can better adapt to the shape and size of the chip, fill the tiny gap between the chip and the encapsulation mold, and improve the sealing and accuracy of the encapsulation.

Strict equipment calibration and quality inspection

Regular calibration: In order to ensure the accuracy of the equipment, the high-precision coupling and sealing machine needs to be calibrated regularly. The calibration includes the positional accuracy of mechanical parts, the measurement accuracy of sensors, and the parameters of the control system. Through the use of standard gauges and calibration instruments, the equipment is fully calibrated and adjusted to ensure that the equipment always maintains a good working condition.

Quality Inspection: During the encapsulation process, real-time quality inspection will be carried out. Through on-line inspection equipment, such as X-ray inspection and ultrasonic inspection, the encapsulated chips will be inspected, so that defects and errors during the encapsulation process will be detected in time, and corresponding corrective measures will be taken to ensure that each encapsulated chip meets the high-precision quality requirements.