LQ-DA1201, a high-speed solid crystal equipment tailored for the IC packaging industry, it is not just cold machinery, but also a blend of innovative high-tech and mature technology wisdom. Imagine what kind of sparks will collide when high-end technology meets with practical experience.
Core Selling Points
1, silver paste placement & DAF process, one machine multi-purpose goodbye single, embrace diversity! LQ-DA1201 supports silver paste placement and advanced DAF (Direct Attachment Film) process, whether you are in pursuit of high efficiency or high quality, it is easy to cope with. Not only that, it is also perfectly compatible with LF and Substrate feeding system, flexible to adapt to different production needs, so that your production line more smooth and unhindered.
2, large capacity, efficient feeding efficiency is the king of the times, LQ-DA1201 also did not fall behind. It supports 12-inch wafer frame and wafer ring DIE feeding, which means more processing capacity and less time for material change, pressing the accelerator button for your production efficiency.
3, precision first, the commitment of 12.5um in the micron-level process, LQ-DA1201 high-speed solid crystal machine with ± 12.5 microns of amazing precision, equivalent to hair 1 / 6, to ensure that the chip mounting precision, yield of up to 99.9% or more, greatly reducing material waste, set a new benchmark for microelectronics packaging.
4, capacity explosion, UPH up to 12K Speaking of capacity, LQ-DA1201 is not inferior. Up to 12,000 pieces per hour processing capacity, so that it stands out in similar equipment, to enhance production capacity, shorten the delivery cycle of the choice.
5, advanced drop glue control system LQ-DA1201 is equipped with an excellent drop glue control system, which can precisely control the amount and position of the glue drops, and improve the reliability and consistency of the solid crystal. The system supports dual-drip gluing system, which further enhances the gluing speed and efficiency, and is suitable for various sizes and types of chips.
6, universal workpiece table design LQ-DA1201 adopts a universal workpiece table design that can handle a wide range of package types and high-density leadframes (300 x 100 mm), improving the flexibility and applicability of the equipment.
7、Advanced Image Recognition SystemLQ-DA1201 is equipped with the most advanced image recognition system - iFlash, as well as an upward-looking inspection system, which is capable of real-time monitoring and correction of errors in the solidification process, improving the accuracy of solidification.
The LQ-DA1201 is a high speed solidification machine for QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA packages.
The LQ-DA1201 High-Speed Solderer is the ideal choice if you are looking for a machine that dramatically improves productivity, ensures high-precision packaging, and is both flexible and reliable. With its excellent performance, it promotes the change of IC packaging industry, bringing efficiency, precision and unlimited possibilities in the future. Let's join hands to create a new chapter of intelligent manufacturing with the power of science and technology, lead the industrial upgrading, and create a brilliant future together!
