Against the backdrop of the continuous outbreak of global AI computing power demand and accelerated upgrading of data center network bandwidth, 400G/800G optical modules, as the core hardware for high-speed interconnections, have seen a rapid growth in the market scale. Lie Intelligence is deeply engaged in the field of semiconductor packaging and optical communication equipment. With industry-leading automation equipment such as pre-sintering placement equipment H3-DB20HF, multi-chip placement equipment H3-DB3000, high-speed solid crystal machine LQ-DA1201, high-precision eutectic placement equipment HP-EB3300, Lie Intelligence has been working closely with Domestic chip manufacturers, optical module manufacturers Provide high-efficiency and high-precision production solutions for domestic chip makers and optical module manufacturers. We provide domestic chip manufacturers and optical module manufacturers with efficient and high-precision production solutions, helping the industry chain break through technical bottlenecks and seize the dividends of AI change.
First, AI-driven optical module demand outbreak, domestic equipment to meet the golden window
Technology Trends: AI large model training and reasoning needs to promote data center network architecture upgrade, 400G/800G optical module penetration rate accelerated, is expected to 2025 the global market size over Tens of billions of dollars.
Opportunity for localization: Domestic capital continues to increase AI arithmetic infrastructure, superimposed on the policy support for chip autonomy, optical module manufacturing equipment (such as patch, solid crystal, bonding and other links) ushered in a critical period of domestic substitution.
LieQi positioning: focusing on high-precision, high-speed, high-yield equipment R & D, covering the entire process of optical module packaging, to solve the overseas “necklace” problem, enabling domestic manufacturers to reduce costs and increase efficiency.
Second, the core equipment technology analysis: for optical module manufacturing efficiency and empowerment
1. Pre-sintering patch equipment H3-DB20HF
Technical highlights:
■ Specialized for the silver sintering process
■ Specialized for silver sintering process research and development, support for fully automatic placement.
■ Ultra-high placement accuracy: supports ±3μm placement accuracy.
■ Pre-heating and pre-pressure nozzle heating: large pressure mounting head integrated with a number of heating functions to enhance the placement stability.
Streamlined and scalable design: equipment design is flexible and solutions can be customized according to needs. Application Scenarios:
● SiC Module Mass Production: Perfectly adapted to the needs of mass production of SiC modules.
● SiC module R&D and testing: Supporting the R&D and testing phase of SiC modules, helping technological innovation.
● High-end Optical Module Encapsulation: Suitable for high-end optical module encapsulation manufacturing to improve product performance and reliability.
△Pre-Sintered Bonder H3-DB20HF
2. Multi-chip placement equipment H3-DB3000
Technical highlights:
■ Ultra-high-precision placement: supports ±3μm placement accuracy to meet the demand for high-precision chip placement.
■ Freely adjustable conveyor system: adjustable width, seamlessly connecting with other equipment, enhancing the flexibility of the production line.
■ Fully-automatic material management: 12-inch wafer loading + automatic wafer / nozzle change, improve production efficiency.
■ Modular and flexible customization: modular design, fast response to diversified placement needs.
■ Intelligent calibration and management: integrated calibration and data management, process traceability and convenient operation.
Application Scenarios:
● Optical Module Mass Production: Suitable for high volume placement production of high-speed optical communication modules.
Semiconductor back-end packaging: meets the packaging needs of high-precision semiconductor devices such as optoelectronics and MEMS.
●High-end chip packaging: supports the manufacturing of chip packaging for multi-chip and complex structures.
△Multi-Chip Mounting Equipment H3-DB3000
3. High-speed solid crystal machine equipment LQ-DA1201
Technical highlights:
■ Dual-process flexibility and compatibility: support for silver paste placement and DAF process, to adapt to the needs of a variety of packaging.
■ Multi-type feeding system: compatible with LF (leadframe) and Substrate (substrate) feeding, to enhance the flexibility of the production line.
■ Large-size wafer adaptation: support for 12-inch wafers and wafer rings to meet the needs of high-density chip production.
Ultra-high precision and efficiency: placement accuracy of ±12.5μm, UPH (output per hour) of 12K, taking into account both speed and yield.
Application Scenarios:
● Optical Module Core Packaging: Suitable for laser/detector chip solidification for high-speed optical communication modules (e.g. 400G/800G).
●Semiconductor IC packaging: to meet the needs of CPU, GPU and other high-end chips in silver paste or DAF process packaging.
●RF/Sensor Manufacturing: Suitable for 5G RF devices, MEMS sensors and other high-precision electronic components packaging scenarios.
△High-speed solid crystal machine equipment LQ-DA1201
4. HP-EB3300 high-precision eutectic placement equipment
Technical highlights:
■ Ultra-high-precision placement: standard chip placement accuracy of up to ± 1.0μm, to ensure the accuracy of the placement process.
■ Dual process compatibility: support for eutectic placement and silver adhesive placement process, to meet the needs of different packages.
■ Various loading methods: compatible with Gel-PAK and blue film loading methods to enhance the flexibility of the production line.
■ Intelligent tool replacement: Equipped with automatic tool replacement system to simplify the operation process and improve production efficiency.
■ High flexibility: suitable for R&D units and industrialized mass production to meet the needs of different scale production.
Application Scenarios:
● Optical Module Packaging: Suitable for packaging of high-speed optical communication modules such as 100G/400G, ensuring accurate placement and coupling of key components.
● Semiconductor packaging: It can be used for packaging and testing of semiconductor chips to meet the needs of high-precision and high-efficiency production.
●Opto-electronic device manufacturing: applicable to chip packaging of opto-electronic devices to enhance device performance and reliability.
● R&D and mass production: applicable to R&D units for small batch trial production, as well as to meet the needs of industrialized mass production, with a high degree of flexibility.
△Fully Automatic High Precision Eutectic Bonder HP-EB3300
Third, the value of the industry chain of Hunting Intelligence: technology + service double drive
Technical barriers to break through: equipment precision, speed, stability against international leaders, helping customers to shorten the optical module R & D cycle, accelerate the mass production ramp.
Full-process service capability: provide one-stop support for process debugging, equipment maintenance, and supply of consumables to reduce customers' comprehensive costs.
Domestic substitution benchmark: has entered the supply chain of Huawei, Asahi Technology and other head manufacturers, equipment localization rate of more than 90%.
Fourth, the outlook: grasping the AI arithmetic infrastructure, continuous iterative innovation
Hunt Intelligence will continue to invest in R & D resources, focusing on the needs of cutting-edge technology, upgrading the performance of the equipment and process compatibility, and build a domestic high-end equipment ecosystem with the industry chain partners, to promote China's optical communication industry to occupy a commanding height in the global competition.
