LQ-DB10 fully automatic multi-chip placement equipment with integrated loading and unloading system, placement accuracy up to ±7μm@3σ, angular accuracy of ±0.5°@3σ, supporting multi-wafers and complex components processing.

The single-head triple wafer ring design can mix and work with three kinds of 6-inch chips of similar sizes, with intelligent nozzle library to realize automatic replacement.

Based on independent algorithms to ensure high-speed stability, modular structure to flexibly adapt to semiconductor packaging, Mini LED and other scenarios, support for hardware configuration and process parameters in-depth customization to meet the needs of high-precision, flexible production.