※ High-speed and accurate solidification capability
Highly rigid design and high-speed IC pickup action maintains high-precision solid mounting (±5 μm/3σ) and 0.65 s/IC
※ Multi-process application range
Supports ultrasonic, thermo-compression, flux-dipped adhesive, and other different processes
※ Simple operation
Adopting a large color touch panel and dialog-type software provides operators with a simple and reliable operating environment.
The large color touch panel and dialog software provide a simple and reliable operating environment for the operator, making it easy to operate for both first-time and skilled operators.
High-speed
Multi-process
Each Other
Mounting Efficiency
Force Control Range
Product Applications
Constant temperature heating
Maximum temperature 300°C, temperature fluctuation ±1°C
Flexible pickup
Supports forward loading, reverse loading, flip pickup, etc.
