The H3-IDB10 equipment is specially developed for mass production of IGBT modules and other industries, with a standard chip placement accuracy of ±5. 0um.

This equipment is equipped with a multi-chip and hybrid chip placement process, compatible with Gel-PAK and blue film loading methods, and has a streamlined design.

Products can be automatically transferred, multiple workstations work in parallel to improve production efficiency, this model can be customized according to the specific application solutions.