H3-DB10A is a high-precision automatic silver adhesive placement equipment.
The equipment is developed for advanced packaging processes with high requirements in terms of precision, throughput and reliability, and is suitable for COB R&D testing or mass production.
The equipment adopts modular design, supports automatic dispensing, automatic nozzle replacement and automatic loading and unloading, etc. The solution can be customized according to the specific needs of users.
Accurate
High Output
High Reliability
Mounting Method
Mounting Process
Application Scenarios
Mounting Accuracy
±3μm (standard sheet); ±7μm (application dependent)
Equipment Efficiency
UPH≈800 (application-dependent)
