LQ-VADB30P is a high-precision multi-chip bonding machine optimized and developed based on its predecessor, which not only provides ±1.5um placement position accuracy, but also meets the demand for high flexibility and high efficiency. It is equipped with the following:

1, up to five pick-and-place tools

2, autofocus optic calibration system

3, 360° angular calibration system

4, simultaneous support for the dipping and dispensing process Equipped with up to five adhesive dipping tools

In high-precision mode can achieve ± 1.5um placement position accuracy (standard chip placement), while achieving a productivity of 600 UPH;

Non-precision mode can achieve ± 3um placement position accuracy (based on the product), while achieving a productivity of 1.2K UPH.